반도체 회로 형성공정이 완료되면 필요한 Package size로 웨이퍼 두께를 연마하게 되는데 이 때 회로 형성된 표면의 보호를 위하여 보호테이프를 사용하게 된다.
반도체 웨이퍼의 백그라인딩된 웨이퍼는 개별소자로 sawing하게 되는데 이 때 칩의 비산을 방지하기 위하여 사용하는 테이프입니다. 일반 감압형과 자외선 경화형이 있습니다.

After finishing patterning on the wafer, we have to grind the backside of the wafer to make it suitable thickness. In this application, PSA tape is used to protect the patterned circuit on the wafer.
After the wafer was finished by polishing and other process, the die on the wafer has to be sawing in each chip. In this application, PSA tape has to be used to prevent the chip-fly and help pick up easily. There are 2kinds of PSA tapes such as non-uv tape, uv curable tape.
 
 
 
- As base film is polyolefin, it is free from deficiencies caused by PVC film such as plasticizer migration, bad odor, and so on.
- It has optimum adhesive strength enough to hold chip during wafer sawing process.
- No contamination on the backside of chip due to deionized water or silicon dust
- Smooth pick-up can be possible after a period of long storage.
- Very excellent lamination with wafer and easy delamination from wafer during backside grinding process.
- Completely free from fish-eye, gel, foreign material and so on which may cause damage to wafer.
- As it is free from silicon , detergent and wax compositions in its adhesive, de-lamination of epoxy never occur during package
  process of chip.
 
 
KS Series
Product Film Type Adhesive Thickness
(㎛)
Width
(m)
Length
(m)
Adhesive
strength
(g/25mm)
KS-130N-AR P/O Non-UV
back grinding
Acrylic 168 230 - wafer
70↑
77
KS-DF1-527 Non-UV
Dicing
150 300 - SUS304
140±20
122
KS-FUB-01 UV-back
grinding
130 200 - SUS304
600±20
582
KS-FUB-300 UV wafer
dicing
135 300 - 450±20 432
 
KSPV 1 Series
Product Film Adhesive Thickness
(㎛)
Width
(m)
Length
(m)
Adhesive strength
(g/25mm)
KSPV-V8S PVC Acrylic 80 300 - 100
KSPV-224 120